| PCB Type | Key Specifications | Applications |
| Rigid PCB | Layers: 1-50+; Min. Line width/spacing: 3/3 mil; IPC class 2 & class 3 | Consumer electronics, industrial controls |
| HDI PCB | Via-in-pad; Blind/buried vias | Robotic control units, 5G devices |
| Flex PCB & Rigid-Flex PCB | Flexible materials: PI/PTFE; Layers: 2-20+ | Wearables, foldable devices |
| High-Frequency PCB | Materials: Rogers, Taconic; Wangling | RF communication, radar |
| Heavy Copper PCB | Copper thickness: 2-20oz; High current carrying capacity | Power supplies, batteries |
| Aluminum/Copper Core PCB | Excellent thermal conductivity | LED lighting, power electronics |
- PCB Fabrication: Cutting → Drilling → Copper plating → Pattern transfer → Etching → Solder mask application → Silk screen printing → Surface finish (LF HASL, ENIG, OSP, etc.) → Outline → E-test → FQC
- Component Sourcing & Inspection: Procurement from authorized distributors → Incoming inspection (optical check, X-ray)
- PCBA Assembly: SMT/THT assembly → Reflow/ wave soldering → Hand touch-up (if needed)
- Quality Inspection: AOI → X-ray → Functional testing → Final visual inspection
- Packaging & Shipping: Anti-static packaging, custom packaging options, global shipping (DHL/FedEx/UPS)
Soldering Process Parameters
- SMT Soldering Method: Reflow Soldering (lead-free / leaded option)
- Temperature Range: 150°C–260°C (adjustable by product type)
- Reflow Profile: Customizable for different PCB materials and component sensitivities
- Soldering Material: Lead-free solder paste (Sn96.5Ag3.0Cu0.5) / leaded solder paste (Sn63Pb37)
- THT Soldering Method: Wave Soldering / Selective Wave Soldering
- Wave Temperature: 245°C–260°C
- Conveyor Speed: 0.8–2.5 m/min (adjustable)
- Manual Soldering: For prototype, rework and high-precision components; Temperature-controlled soldering stations (350°C±10°C)
Inspection Parameters
- AOI (Automated Optical Inspection): 100% post-reflow inspection; Resolution ≥ 5μm; Defect detection rate ≥ 99.5%
- AXI (Automated X-Ray Inspection): For BGA, QFN, CSP and other hidden solder joints; X-ray voltage: 10–160kV
- Functional Test (FCT): Customizable test fixtures; Support in-circuit test (ICT), boundary scan test (BST)
Precision & Tolerance
- Component Placement Accuracy:
- Chip components (0201–1206): ±0.05mm
- IC components (QFP/BGA/QFN): ±0.03mm
- Large components (≥50mm): ±0.1mm
- Soldering Tolerance: Solder joint wetting rate ≥ 95%; No solder bridging, tombstoning, cold solder or solder balls defects (compliant with IPC-A-610J Class 2/3)
Component Package Range
SMT: 01005, 0201, 0402, 0603, 0805, 1206, 1210, 2512, QFP (Quad Flat Package), QFN (Quad Flat No-leads), BGA (Ball Grid Array), CSP (Chip Scale Package), SOP /SOIC (Small Outline Package), PLCC (Plastic Leaded Chip Carrier),
Power Components: D2PAK, TO-220, TO-247, SOT-223,
High-Frequency/RF: SMD RF Connectors, LGA (Land Grid Array), MCM (Multi-Chip Module)
Through-Hole Components: DIP (Dual In-line Package), TO (Transistor Outline), SIP (Single In-line Package), terminal blocks, connectors
DZPCBA 