Soldering Process Parameters

• SMT Soldering Method: Reflow Soldering (lead-free / leaded option)
  • Temperature Range: 150°C–260°C (adjustable by product type)
  • Reflow Profile: Customizable for different PCB materials and component sensitivities
  • Soldering Material: Lead-free solder paste (Sn96.5Ag3.0Cu0.5) / leaded solder paste (Sn63Pb37)
• THT Soldering Method: Wave Soldering / Selective Wave Soldering
  • Wave Temperature: 245°C–260°C
  • Conveyor Speed: 0.8–2.5 m/min (adjustable)
• Manual Soldering: For prototype, rework and high-precision components; Temperature-controlled soldering stations (350°C±10°C)

Inspection Parameters

• AOI (Automated Optical Inspection): 100% post-reflow inspection; Resolution ≥ 5μm; Defect detection rate ≥ 99.5%
• AXI (Automated X-Ray Inspection): For BGA, QFN, CSP and other hidden solder joints; X-ray voltage: 10–160kV
• Functional Test (FCT): Customizable test fixtures; Support in-circuit test (ICT), boundary scan test (BST)

Precision & Tolerance

• Component Placement Accuracy:
  • Chip components (0201–1206): ±0.05mm
  • IC components (QFP/BGA/QFN): ±0.03mm
  • Large components (≥50mm): ±0.1mm
• Soldering Tolerance: Solder joint wetting rate ≥ 95%; No solder bridging, tombstoning, cold solder or solder balls defects (compliant with IPC-A-610J Class 2/3)

Component Package Range

SMT: 01005, 0201, 0402, 0603, 0805, 1206, 1210, 2512, QFP (Quad Flat Package), QFN (Quad Flat No-leads), BGA (Ball Grid Array), CSP (Chip Scale Package), SOP /SOIC (Small Outline Package), PLCC (Plastic Leaded Chip Carrier),

Power Components: D2PAK, TO-220, TO-247, SOT-223,

High-Frequency/RF: SMD RF Connectors, LGA (Land Grid Array), MCM (Multi-Chip Module) Through-Hole Components: DIP (Dual In-line Package), TO (Transistor Outline), SIP (Single In-line Package), terminal blocks, connectors