Services

1 Surface Mount Technology (SMT Assembly)

Capabilities: Automated component placement (down to 01005 packages, BGA, fine-pitch devices), 500,000+ placements per hour, humidity-controlled component storage for moisture-sensitive devices
Process: Stencil printing → Component placement → Reflow soldering → 3D AOI inspection

2 Through-Hole Technology (THT Assembly)

Capabilities: Automated insertion (60,000+ insertions per hour), hand assembly for complex components (heatsinks, transformers, RF shields), through-hole LED assembly
Application: Power supplies, ruggedized electronic modules, industrial control systems

3 Hybrid Assembly & Custom Services

Hybrid SMT/THT assembly, IC programming, laser labeling/coding, conformal coating for environmental protection

Turnkey & Partial Turnkey Services

Full Turnkey: End-to-end service including component sourcing, assembly, testing, and packaging
Partial Turnkey: Assembly service with customer-provided components
Consigned Assembly: Use customer-supplied PCBs and components for assembly

Testing & Quality Assurance Services

Automated Optical Inspection (AOI): 2D/3D AOI post-soldering to detect soldering defects
X-Ray Inspection: For BGA, QFN, and hidden solder joints
Functional Testing: Custom test fixtures to verify PCBA functionality (power-on test, signal integrity test)
In-Circuit Testing (ICT): Detect component defects, open/short circuits

Environmental Testing: Temperature, humidity, and vibration testing